EP3C25F324I7 vs EP3C16F484I7N Vergleich
Detaillierter Direktvergleich von EP3C25F324I7 von Intel und EP3C16F484I7N von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C25F324I7 | EP3C16F484I7N |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $64,80 | $36,40 |
| Series | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 24,624 | — |
| Logic Array Blocks (LABs) | 1,539 | — |
| Embedded Memory | 608,256 bits (594 Kbits M9K blocks) | — |
| Embedded 18x18 Multipliers | 66 | — |
| PLLs | 4 | [DATA_NEEDED: PLL count from datasheet] |
| Global Clock Networks | 20 | 20 |
| Maximum User I/O | 215 | — |
| Process Technology | TSMC 65 nm low-power CMOS | 65 nm |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | — |
| Betriebs-Sperrschichttemperatur | -40 °C to +100 °C (industrial) | — |
| Gehäuse | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 484-FBGA (FineLine BGA, 1.0 mm pitch) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| RoHS-Status | Compliant | Compliant |
| Family | — | Cyclone III |
| Logic Elements (LE) | — | 15408 |
| Total Memory Bits | — | 516096 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: LAB count] |
| Embedded Multipliers (18x18) | — | 56 |
| User I/O Pins | — | 346 |
| Core Voltage | — | 1.2 V |
| Betriebstemperatur | — | -40C to +100C (Industrial) |
| Speed/Grade | — | I7 (industrial, 7 speed grade) |
| Lead-Free | — | Yes (N suffix) |
| Configuration Mode | — | SRAM / JTAG / Passive Serial |