EP3C25F324I7 vs EP3C16F484I7N Comparación
Comparación detallada lado a lado de EP3C25F324I7 por Intel y EP3C16F484I7N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C25F324I7 | EP3C16F484I7N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $64,80 | $36,40 |
| Series | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 24,624 | — |
| Logic Array Blocks (LABs) | 1,539 | — |
| Embedded Memory | 608,256 bits (594 Kbits M9K blocks) | — |
| Embedded 18x18 Multipliers | 66 | — |
| PLLs | 4 | [DATA_NEEDED: PLL count from datasheet] |
| Global Clock Networks | 20 | 20 |
| Maximum User I/O | 215 | — |
| Process Technology | TSMC 65 nm low-power CMOS | 65 nm |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | — |
| Temperatura de unión de funcionamiento | -40 °C to +100 °C (industrial) | — |
| Encapsulado | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 484-FBGA (FineLine BGA, 1.0 mm pitch) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| Estado RoHS | Compliant | Compliant |
| Family | — | Cyclone III |
| Logic Elements (LE) | — | 15408 |
| Total Memory Bits | — | 516096 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: LAB count] |
| Embedded Multipliers (18x18) | — | 56 |
| User I/O Pins | — | 346 |
| Core Voltage | — | 1.2 V |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial) |
| Speed/Grade | — | I7 (industrial, 7 speed grade) |
| Lead-Free | — | Yes (N suffix) |
| Configuration Mode | — | SRAM / JTAG / Passive Serial |