EP3C25F324I7 vs EP3C25F324I7N Vergleich
Detaillierter Direktvergleich von EP3C25F324I7 von Intel und EP3C25F324I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C25F324I7 | EP3C25F324I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $64,80 | $58,20 |
| Series | Cyclone III | — |
| Logic Elements (LEs) | 24,624 | 24,624 |
| Logic Array Blocks (LABs) | 1,539 | — |
| Embedded Memory | 608,256 bits (594 Kbits M9K blocks) | 608,256 bits (66 M9K blocks of 9 Kbits each) |
| Embedded 18x18 Multipliers | 66 | 66 |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Maximum User I/O | 215 | — |
| Process Technology | TSMC 65 nm low-power CMOS | 65 nm |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | — |
| Betriebs-Sperrschichttemperatur | -40 °C to +100 °C (industrial) | — |
| Gehäuse | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 324-ball FBGA (Fine-Pitch BGA) |
| Montageart | Surface Mount | — |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) |
| RoHS-Status | Compliant | Compliant |
| Family | — | Cyclone III |
| Maximum User I/O Pins | — | 215 |
| LVDS Pairs | — | 66 |
| Core Voltage | — | 1.2 V |
| I/O Bank Voltage Range | — | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) |
| Betriebstemperatur | — | -40C to +100C (Industrial) |
| Speed Grade | — | 7 (slower speed grade, lower power) |
| Lead-Free | — | Yes |
| MSL-Level | — | 3 (168 hours) |