EP3C40F324C8N vs EP3C40F324I7N Vergleich
Detaillierter Direktvergleich von EP3C40F324C8N von Intel und EP3C40F324I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C40F324C8N | EP3C40F324I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $56,20 | $52,10 |
| Series | Cyclone III | — |
| Family | Cyclone III (EP3C40) | Cyclone III |
| Logic Elements (LE) | 39,600 | 39,600 |
| Embedded Memory (bits) | 1,161,216 (~1.16 Mbit) | — |
| Embedded 18x18 Multipliers | 126 | — |
| Maximum User I/O | 215 | 195 |
| PLLs | 4 | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS (TSMC) | 65 nm low-power CMOS (TSMC) |
| Maximum Core Frequency | 402 MHz (speed grade 8) | — |
| Betriebstemperatur | 0C to +85C (commercial, C8 suffix) | -40 C to +100 C (Industrial) |
| Configuration Method | SRAM (volatile), requires external boot device | — |
| Gehäuse | FBGA-324 (324-ball FineLine BGA) | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 2.2 mm height |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Array Blocks / LABs | — | [DATA_NEEDED: LAB count] |
| Total Memory Bits | — | 1,161,216 bits |
| Embedded Multipliers (18x18) | — | 126 |
| General-Purpose PLLs | — | 4 |
| Core Voltage (VCCINT) | — | 1.15 V to 1.25 V |
| Maximum Internal Clock Frequency | — | 437.5 MHz |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) |