EP3C40F780C8 vs EP3C40F780I8N Vergleich

Detaillierter Direktvergleich von EP3C40F780C8 von Intel und EP3C40F780I8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3C40F780C8 EP3C40F780I8N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $99,95 $192,00
Family Cyclone III Cyclone III
Series EP3C40 —
Logic Elements 39,600 —
Total Memory Bits 1,161,216 bits (1134 Kbit) —
Embedded Memory M9K blocks, 486 Kbit total (per family datasheet) —
Embedded 18x18 Multipliers 126 —
General Purpose PLLs 4 —
Global Clock Networks 20 —
Maximum User I/O Pins 535 —
Process Technology 65 nm low-power CMOS TSMC 65 nm low-power CMOS
Gehäuse 780-ball FBGA (FineLine BGA) 780-ball FBGA (F780)
Speed Grade C8 (commercial, -40C to +85C operating range per 'C' designator family convention) —
User I/O Banks [DATA_NEEDED: user I/O bank count] —
Supported Memory Interfaces DDR, DDR2, QDRII SRAM (via dedicated PHY) —
Configuration Serial (AS) / Parallel (AP) / JTAG —
RoHS-Status Compliant Compliant
Montageart Surface Mount (BGA) Surface Mount (BGA)
Device Logic Elements — 39,600
Logic Array Blocks (LABs/CLBs) — 2,475
Embedded Memory (bits) — 1,161,216
Embedded Memory (Kbits) — 1,134
Embedded Multipliers (18x18) — 126
Number of PLLs — 4
User I/O Pins — 535
I/O Banks — 20
Nominal Core Supply Voltage — 1.2 V (1.15 V to 1.25 V)
Package Ball Pitch — 1.0 mm
Operating Temperature Grade — Industrial (-40 °C to +100 °C junction)
Configuration Modes — Passive Serial, Active Serial (EPCS), JTAG, Fast Passive Parallel
MSL-Level — 3

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