EP3C40F780C8N vs EP3C40F780I7 Vergleich
Detaillierter Direktvergleich von EP3C40F780C8N von Intel und EP3C40F780I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C40F780C8N | EP3C40F780I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $64,85 | $52,40 |
| Series | Cyclone® III | — |
| Family | Cyclone III | Cyclone® III |
| Logic Elements (LE) | 39,600 | — |
| Total Memory Bits | 1,161,216 bits | — |
| Number of LABs/CLBs | 2,475 | — |
| Embedded Memory Blocks | M9K x 126 | — |
| Embedded 18x18 Multipliers | 126 (up to 396 9x9) | — |
| Number of PLLs | 4 | — |
| Maximum User I/Os | 535 | 535 |
| Number of I/O Banks | 9 | — |
| Core Voltage | 1.15V to 1.25V | — |
| Betriebstemperatur | 0°C to +85°C (Commercial) | -40C to +100C (industrial, I7) |
| Speed Grade | 8 (C8) | — |
| Gehäuse | 780-ball FBGA, 1.0mm pitch | 780-ball FineLine BGA (F780) |
| Montageart | Surface Mount (BGA) | — |
| Process Technology | 65nm TSMC low-power | 65 nm low-power CMOS |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| RoHS-Status | Compliant | Compliant |
| Logic Elements (LEs) | — | 39,600 |
| Embedded Memory Bits | — | 1,161,216 bits |
| M9K Memory Blocks | — | 234 |
| MLAB Memory Bits | — | 112,500 bits |
| Embedded Multipliers (18x18) | — | 126 |
| 9-bit Multiplier Elements | — | 535 |
| PLLs | — | 4 |
| Maximum Operating Frequency | — | 472.5 MHz |
| Core Voltage (VCCINT) | — | 1.2 V |
| Package Dimensions | — | [DATA_NEEDED: package dimensions in mm] |
| Configuration Method | — | JTAG / Active Serial / Passive Serial |
| Toolchain | — | Quartus II / Quartus Prime |