EP3C40F780C8N vs EP3C40F780I7 Comparación
Comparación detallada lado a lado de EP3C40F780C8N por Intel y EP3C40F780I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C40F780C8N | EP3C40F780I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $64,85 | $52,40 |
| Series | Cyclone® III | — |
| Family | Cyclone III | Cyclone® III |
| Logic Elements (LE) | 39,600 | — |
| Total Memory Bits | 1,161,216 bits | — |
| Number of LABs/CLBs | 2,475 | — |
| Embedded Memory Blocks | M9K x 126 | — |
| Embedded 18x18 Multipliers | 126 (up to 396 9x9) | — |
| Number of PLLs | 4 | — |
| Maximum User I/Os | 535 | 535 |
| Number of I/O Banks | 9 | — |
| Core Voltage | 1.15V to 1.25V | — |
| Temperatura de funcionamiento | 0°C to +85°C (Commercial) | -40C to +100C (industrial, I7) |
| Speed Grade | 8 (C8) | — |
| Encapsulado | 780-ball FBGA, 1.0mm pitch | 780-ball FineLine BGA (F780) |
| Tipo de montaje | Surface Mount (BGA) | — |
| Process Technology | 65nm TSMC low-power | 65 nm low-power CMOS |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Estado RoHS | Compliant | Compliant |
| Logic Elements (LEs) | — | 39,600 |
| Embedded Memory Bits | — | 1,161,216 bits |
| M9K Memory Blocks | — | 234 |
| MLAB Memory Bits | — | 112,500 bits |
| Embedded Multipliers (18x18) | — | 126 |
| 9-bit Multiplier Elements | — | 535 |
| PLLs | — | 4 |
| Maximum Operating Frequency | — | 472.5 MHz |
| Core Voltage (VCCINT) | — | 1.2 V |
| Package Dimensions | — | [DATA_NEEDED: package dimensions in mm] |
| Configuration Method | — | JTAG / Active Serial / Passive Serial |
| Toolchain | — | Quartus II / Quartus Prime |