EP3C55F484C6 vs EP3C55F484C8 Vergleich
Detaillierter Direktvergleich von EP3C55F484C6 von Intel und EP3C55F484C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55F484C6 | EP3C55F484C8 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $222,00 | $138,40 |
| Family | Cyclone III | — |
| Series | EP3C55 | — |
| Logic Elements | 55,856 LE | — |
| Embedded Memory | 2,396,160 bits (2.4 Mbit) | — |
| Maximum User I/O | 327 | — |
| Gehäuse | 484-FBGA (F484) | 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch, 2.60 mm height |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS |
| Core Voltage | 1.2 V | — |
| Speed Grade | 6 (commercial) | C8 (commercial, -8) |
| Number of PLLs | 4 | — |
| Global Clock Networks | 20 | 20 |
| Embedded 18x18 Multipliers | 56 | 312 |
| I/O Banks | 8 | — |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Configuration | JTAG, AS (EPCS), PS, FPP | — |
| Montageart | Surface Mount (BGA) | — |
| RoHS-Status | Compliant | — |
| Betriebstemperatur | 0C to +85C (commercial) | Commercial (0C to +85C) |
| Device Family | — | Cyclone® III |
| Logic Elements (LEs) | — | 55,856 |
| Logic Array Blocks (LABs) | — | 3,491 |
| Embedded Memory Bits | — | 2,396,160 bits |
| User I/Os | — | 327 |
| PLLs | — | 4 |
| Maximum Core Frequency | — | 472.5 MHz |
| Configuration Modes | — | JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS) |
| Lead-Free / RoHS | — | Yes (Pb-free FBGA) |
| Versorgungsspannung | — | Core 1.2 V typical, I/O bank dependent |
| I/O Standards Supported | — | LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI, and others |