EP3C55F484C6 vs EP3C55F484C8 对比
详细并排对比 EP3C55F484C6 出自 Intel 和 EP3C55F484C8 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3C55F484C6 | EP3C55F484C8 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $222.00 | $138.40 |
| Family | Cyclone III | — |
| Series | EP3C55 | — |
| Logic Elements | 55,856 LE | — |
| Embedded Memory | 2,396,160 bits (2.4 Mbit) | — |
| Maximum User I/O | 327 | — |
| 封装 | 484-FBGA (F484) | 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch, 2.60 mm height |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS |
| Core Voltage | 1.2 V | — |
| Speed Grade | 6 (commercial) | C8 (commercial, -8) |
| Number of PLLs | 4 | — |
| Global Clock Networks | 20 | 20 |
| Embedded 18x18 Multipliers | 56 | 312 |
| I/O Banks | 8 | — |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Configuration | JTAG, AS (EPCS), PS, FPP | — |
| 安装类型 | Surface Mount (BGA) | — |
| RoHS 状态 | Compliant | — |
| 工作温度 | 0C to +85C (commercial) | Commercial (0C to +85C) |
| Device Family | — | Cyclone® III |
| Logic Elements (LEs) | — | 55,856 |
| Logic Array Blocks (LABs) | — | 3,491 |
| Embedded Memory Bits | — | 2,396,160 bits |
| User I/Os | — | 327 |
| PLLs | — | 4 |
| Maximum Core Frequency | — | 472.5 MHz |
| Configuration Modes | — | JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS) |
| Lead-Free / RoHS | — | Yes (Pb-free FBGA) |
| 电源电压 | — | Core 1.2 V typical, I/O bank dependent |
| I/O Standards Supported | — | LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI, and others |