EP3C55F780C6N vs EP3C40F780C8N Vergleich
Detaillierter Direktvergleich von EP3C55F780C6N von Intel und EP3C40F780C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55F780C6N | EP3C40F780C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $52,10 | $64,85 |
| Series | Cyclone III | Cyclone® III |
| Family | Cyclone III FPGA | Cyclone III |
| Logic Elements (LE) | 55,856 | 39,600 |
| Embedded Memory (bits) | 2,396,160 | — |
| Embedded Memory (Kb) | 2,340 Kb | — |
| Embedded 18x18 Multipliers | 312 | 126 (up to 396 9x9) |
| Maximum User I/O | 377 | — |
| PLLs | 4 | — |
| Global Clocks | 20 | — |
| Process Technology | 65 nm low-power CMOS | 65nm TSMC low-power |
| Gehäuse | 780-ball FBGA (F780) | 780-ball FBGA, 1.0mm pitch |
| Package Code | BGA, 780 balls | — |
| Speed Grade | C6 | 8 (C8) |
| Betriebstemperatur | 0C to +85C (commercial) | 0°C to +85°C (Commercial) |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Voltage - Supply (Core) | 1.2 V (typical) | — |
| Voltage - I/O | Multi-standard (LVTTL/LVCMOS/LVDS/SSTL/PCI) | — |
| Total Memory Bits | — | 1,161,216 bits |
| Number of LABs/CLBs | — | 2,475 |
| Embedded Memory Blocks | — | M9K x 126 |
| Number of PLLs | — | 4 |
| Maximum User I/Os | — | 535 |
| Number of I/O Banks | — | 9 |
| Core Voltage | — | 1.15V to 1.25V |
| Configuration Modes | — | AS, PS, FPP, JTAG |