EP3C55F780C6N vs EP3C40F780C8N Comparación
Comparación detallada lado a lado de EP3C55F780C6N por Intel y EP3C40F780C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C55F780C6N | EP3C40F780C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $52,10 | $64,85 |
| Series | Cyclone III | Cyclone® III |
| Family | Cyclone III FPGA | Cyclone III |
| Logic Elements (LE) | 55,856 | 39,600 |
| Embedded Memory (bits) | 2,396,160 | — |
| Embedded Memory (Kb) | 2,340 Kb | — |
| Embedded 18x18 Multipliers | 312 | 126 (up to 396 9x9) |
| Maximum User I/O | 377 | — |
| PLLs | 4 | — |
| Global Clocks | 20 | — |
| Process Technology | 65 nm low-power CMOS | 65nm TSMC low-power |
| Encapsulado | 780-ball FBGA (F780) | 780-ball FBGA, 1.0mm pitch |
| Package Code | BGA, 780 balls | — |
| Speed Grade | C6 | 8 (C8) |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0°C to +85°C (Commercial) |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Voltage - Supply (Core) | 1.2 V (typical) | — |
| Voltage - I/O | Multi-standard (LVTTL/LVCMOS/LVDS/SSTL/PCI) | — |
| Total Memory Bits | — | 1,161,216 bits |
| Number of LABs/CLBs | — | 2,475 |
| Embedded Memory Blocks | — | M9K x 126 |
| Number of PLLs | — | 4 |
| Maximum User I/Os | — | 535 |
| Number of I/O Banks | — | 9 |
| Core Voltage | — | 1.15V to 1.25V |
| Configuration Modes | — | AS, PS, FPP, JTAG |