EP3C55F780C6N vs EP3C55F780C6 Vergleich
Detaillierter Direktvergleich von EP3C55F780C6N von Intel und EP3C55F780C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55F780C6N | EP3C55F780C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $52,10 | $209,22 |
| Series | Cyclone III | Cyclone III |
| Family | Cyclone III FPGA | — |
| Logic Elements (LE) | 55,856 | — |
| Embedded Memory (bits) | 2,396,160 | — |
| Embedded Memory (Kb) | 2,340 Kb | — |
| Embedded 18x18 Multipliers | 312 | — |
| Maximum User I/O | 377 | — |
| PLLs | 4 | — |
| Global Clocks | 20 | — |
| Process Technology | 65 nm low-power CMOS | 65 nm low power |
| Gehäuse | 780-ball FBGA (F780) | 780-ball FBGA |
| Package Code | BGA, 780 balls | — |
| Speed Grade | C6 | -6 (C6) |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (Commercial) |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Voltage - Supply (Core) | 1.2 V (typical) | — |
| Voltage - I/O | Multi-standard (LVTTL/LVCMOS/LVDS/SSTL/PCI) | — |
| Logic Elements | — | 55,856 |
| Embedded Memory Bits | — | 2,396,160 |
| Number of Block RAM (M9K) | — | 260 |
| 18x18 Hardware Multipliers | — | 156 |
| User I/Os | — | 377 |
| Configuration Methods | — | JTAG, AS, AP, PS |
| Number of PLLs | — | 4 |
| Maximum User I/O Voltage Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |