EP3C55F780C7 vs EP3C55F780C6N Vergleich
Detaillierter Direktvergleich von EP3C55F780C7 von Intel und EP3C55F780C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55F780C7 | EP3C55F780C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $76,75 | $52,10 |
| Family | Cyclone III | Cyclone III FPGA |
| Logic Elements (LE) | 55,856 | 55,856 |
| Embedded Memory Bits | 2,396,160 bits (~234 Kbyte M9K) | — |
| Embedded 18x18 Multipliers | 234 | 312 |
| PLLs | 4 | 4 |
| Maximum User I/O Pins | 377 | — |
| Gehäuse | 780-ball FBGA (F780) | 780-ball FBGA (F780) |
| Core Voltage (VCCINT) | 1.2 V | — |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Process Technology | 65 nm TSMC low-power CMOS | 65 nm low-power CMOS |
| Operating Temperature Grade | Commercial (C) | — |
| Speed Grade | 7 | C6 |
| Configuration Modes | AS, PS, JTAG, FPP | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Series | — | Cyclone III |
| Embedded Memory (bits) | — | 2,396,160 |
| Embedded Memory (Kb) | — | 2,340 Kb |
| Maximum User I/O | — | 377 |
| Global Clocks | — | 20 |
| Package Code | — | BGA, 780 balls |
| Betriebstemperatur | — | 0C to +85C (commercial) |
| Voltage - Supply (Core) | — | 1.2 V (typical) |
| Voltage - I/O | — | Multi-standard (LVTTL/LVCMOS/LVDS/SSTL/PCI) |