EP3C55F780C8N vs EP3CLS100F780C8N Vergleich

Detaillierter Direktvergleich von EP3C55F780C8N von Intel und EP3CLS100F780C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3C55F780C8N EP3CLS100F780C8N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $58,20 $105,80
Series Cyclone III —
Family Cyclone III (low-cost FPGA) —
Logic Elements (LE) 55,856 100,448
Logic Array Blocks (LAB) 3,491 6,278
Total RAM Bits 2,396,160 bits (2396 Kbit) —
Embedded Memory Blocks (M9K) 260 —
Embedded 18x18 Multipliers 156 —
PLLs 4 —
Maximum User I/O 377 429
User I/O Banks 4 —
Process Technology 65 nm TSMC low-power 65 nm low-power CMOS
Core Supply Voltage 1.15 V to 1.25 V —
Gehäuse 780-pin FBGA (29x29 mm, 1.0 mm pitch) 780-ball FBGA (FineLine BGA)
Speed Grade 8 (commercial, slowest) —
Betriebstemperatur 0C to +85C (commercial, 'C' suffix) —
Configuration Modes Active Serial, Passive Serial, Fast Passive Parallel, JTAG —
Internal Frequency (typ.) 402 MHz —
RoHS-Status Compliant (lead-free FBGA) Compliant
Device Family — Cyclone III LS
Total Memory Bits — 4,451,328
Embedded Memory Blocks — M9K + M144K
Number of PLLs — 4
Core Supply Voltage (VCCINT) — 1.2 V
Analog Supply (VCCA) — 2.5 V
Maximum Embedded Multipliers (18x18) — 244
Package Dimensions — 29 mm x 29 mm, 1.0 mm ball pitch
Operating Temperature (Commercial) — 0C to +85C
Montageart — Surface Mount (BGA)
Configuration Schemes — AS, PS, PP, JTAG
Lead-Free — Yes

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