EP3C55F780C8N vs EP3CLS100F780C8N 对比

详细并排对比 EP3C55F780C8N 出自 Intel 和 EP3CLS100F780C8N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3C55F780C8N EP3CLS100F780C8N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 有效
库存状态 有库存 有库存
单价(USD) $58.20 $105.80
Series Cyclone III —
Family Cyclone III (low-cost FPGA) —
Logic Elements (LE) 55,856 100,448
Logic Array Blocks (LAB) 3,491 6,278
Total RAM Bits 2,396,160 bits (2396 Kbit) —
Embedded Memory Blocks (M9K) 260 —
Embedded 18x18 Multipliers 156 —
PLLs 4 —
Maximum User I/O 377 429
User I/O Banks 4 —
Process Technology 65 nm TSMC low-power 65 nm low-power CMOS
Core Supply Voltage 1.15 V to 1.25 V —
封装 780-pin FBGA (29x29 mm, 1.0 mm pitch) 780-ball FBGA (FineLine BGA)
Speed Grade 8 (commercial, slowest) —
工作温度 0C to +85C (commercial, 'C' suffix) —
Configuration Modes Active Serial, Passive Serial, Fast Passive Parallel, JTAG —
Internal Frequency (typ.) 402 MHz —
RoHS 状态 Compliant (lead-free FBGA) Compliant
Device Family — Cyclone III LS
Total Memory Bits — 4,451,328
Embedded Memory Blocks — M9K + M144K
Number of PLLs — 4
Core Supply Voltage (VCCINT) — 1.2 V
Analog Supply (VCCA) — 2.5 V
Maximum Embedded Multipliers (18x18) — 244
Package Dimensions — 29 mm x 29 mm, 1.0 mm ball pitch
Operating Temperature (Commercial) — 0C to +85C
安装类型 — Surface Mount (BGA)
Configuration Schemes — AS, PS, PP, JTAG
Lead-Free — Yes

数据手册与资源

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