EP3C55U484C7N vs EP3C55U484C7 Vergleich
Detaillierter Direktvergleich von EP3C55U484C7N von Intel und EP3C55U484C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55U484C7N | EP3C55U484C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $140,25 | $23,10 |
| Series | Cyclone III | Cyclone III |
| Logic Elements | 55,856 | — |
| Embedded Memory Bits | 2,396,160 (2.4 Mbit) | — |
| Maximum User I/Os | 327 | — |
| I/O Banks | 8 | — |
| DSP Blocks (18 x 18 Multipliers) | 156 (260 multipliers reported by some sources - [DATA_NEEDED: confirm multiplier count from device handbook]) | — |
| PLLs | 4 | — |
| M9K Memory Blocks | 260 | — |
| Process Technology | 65 nm low-power CMOS | 65 nm CMOS |
| Core Voltage (VCCINT) | 1.2 V | — |
| Betriebstemperatur | 0 °C to +85 °C (commercial) | 0C to +85C (Commercial) |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Gehäuse | 484-pin UBGA (Ultra FineLine BGA), 19 mm × 19 mm | 484-ball UBGA (Ultra-FineLine BGA) |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| RoHS-Status | Compliant | Compliant |
| Logic Elements (LEs) | — | 55,856 |
| Logic Array Blocks (LABs) | — | 3,488 |
| Embedded Memory (bits) | — | 2,396,160 |
| Embedded Multipliers (18x18) | — | 156 |
| Maximum User I/O Pins | — | 327 |
| Number of PLLs | — | 4 |
| Maximum Operating Frequency | — | 437 MHz |
| Core Voltage | — | 1.2 V |
| I/O Bank Voltages | — | 1.2 V / 2.5 V / 3.0 V / 3.3 V |
| Package Dimensions | — | 19 x 19 mm |
| Ball Pitch | — | 0.80 mm |
| Speed Grade | — | C7 (Commercial) |