EP3C55U484C7N vs EP3C55U484C7 Comparación
Comparación detallada lado a lado de EP3C55U484C7N por Intel y EP3C55U484C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C55U484C7N | EP3C55U484C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $140,25 | $23,10 |
| Series | Cyclone III | Cyclone III |
| Logic Elements | 55,856 | — |
| Embedded Memory Bits | 2,396,160 (2.4 Mbit) | — |
| Maximum User I/Os | 327 | — |
| I/O Banks | 8 | — |
| DSP Blocks (18 x 18 Multipliers) | 156 (260 multipliers reported by some sources - [DATA_NEEDED: confirm multiplier count from device handbook]) | — |
| PLLs | 4 | — |
| M9K Memory Blocks | 260 | — |
| Process Technology | 65 nm low-power CMOS | 65 nm CMOS |
| Core Voltage (VCCINT) | 1.2 V | — |
| Temperatura de funcionamiento | 0 °C to +85 °C (commercial) | 0C to +85C (Commercial) |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Encapsulado | 484-pin UBGA (Ultra FineLine BGA), 19 mm × 19 mm | 484-ball UBGA (Ultra-FineLine BGA) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Estado RoHS | Compliant | Compliant |
| Logic Elements (LEs) | — | 55,856 |
| Logic Array Blocks (LABs) | — | 3,488 |
| Embedded Memory (bits) | — | 2,396,160 |
| Embedded Multipliers (18x18) | — | 156 |
| Maximum User I/O Pins | — | 327 |
| Number of PLLs | — | 4 |
| Maximum Operating Frequency | — | 437 MHz |
| Core Voltage | — | 1.2 V |
| I/O Bank Voltages | — | 1.2 V / 2.5 V / 3.0 V / 3.3 V |
| Package Dimensions | — | 19 x 19 mm |
| Ball Pitch | — | 0.80 mm |
| Speed Grade | — | C7 (Commercial) |