EP3C5F256C6 vs EP3C25F256C8N Vergleich
Detaillierter Direktvergleich von EP3C5F256C6 von Intel und EP3C25F256C8N von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C5F256C6 | EP3C25F256C8N |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $21,40 | $38,95 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 5,136 | — |
| Logic Array Blocks (LABs) | 5136 / 342 (per ADatasheet summary) | — |
| Total Memory Bits | 423,936 bits | — |
| Embedded Memory | M9K blocks (per Cyclone III family) | — |
| Embedded 18x18 Multipliers | 23 | 66 |
| User I/Os | 182 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.15 V to 1.25 V (typical 1.2 V) | 1.15 V to 1.25 V |
| Process Technology | 65 nm CMOS, low-k | — |
| Maximum Operating Frequency | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] | — |
| Gehäuse | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch | 256-pin FBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Operating Temperature (Commercial) | 0C to +85C (per device suffix C6) | — |
| Configuration Modes | AS, PS, JTAG | — |
| RoHS-Status | Compliant (lead-free per FBGA package) | Compliant |
| Series | — | Cyclone III |
| Logic Elements (LEs) | — | 24,624 |
| Embedded Memory Bits | — | 608,256 (594 Kbit) |
| User I/O Pins | — | 156 |
| Betriebstemperatur | — | 0 C to +85 C (commercial) |
| Speed Grade | — | 8 |
| MSL-Level | — | 3 (per JEDEC J-STD-020) |
| Lead-Free | — | Yes (Pb-free) |
| Halogenfrei | — | Yes |