EP3C5F256C6 vs EP3C5F256C8 Vergleich

Detaillierter Direktvergleich von EP3C5F256C6 von Intel und EP3C5F256C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3C5F256C6 EP3C5F256C8
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $21,40 $12,30
Family Cyclone III —
Logic Elements (LE) 5,136 —
Logic Array Blocks (LABs) 5136 / 342 (per ADatasheet summary) —
Total Memory Bits 423,936 bits 423,936
Embedded Memory M9K blocks (per Cyclone III family) —
Embedded 18x18 Multipliers 23 —
User I/Os 182 —
PLLs 4 Yes (general-purpose PLLs)
Global Clock Networks 20 —
Core Voltage 1.15 V to 1.25 V (typical 1.2 V) —
Process Technology 65 nm CMOS, low-k 65 nm low-power CMOS
Maximum Operating Frequency [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] —
Gehäuse 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch —
Montageart Surface Mount Surface Mount
Operating Temperature (Commercial) 0C to +85C (per device suffix C6) —
Configuration Modes AS, PS, JTAG —
RoHS-Status Compliant (lead-free per FBGA package) Lead Free, MS-034
Device Type — FPGA - Field Programmable Gate Array
Series — Cyclone III
Logic Elements — 5,136
Number of LABs/CLBs — 321
Number of Logic Elements/Cells — 5,136
Maximum User I/O — 182
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Betriebstemperatur — -40°C to +125°C
Package Type — 256-LBGA (FineLine BGA)
Package Code — FBGA-256
Versorgungsspannung — [DATA_NEEDED: VCCINT/VCCA/VCCIO supply voltage values]
Configuration Memory — External flash via AS/PS/JTAG/FPP
Embedded Multipliers — Yes (18x18 hard multipliers)
MSL-Level — [DATA_NEEDED: MSL rating]

Datenblätter & Ressourcen

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