EP3C5F256C6 vs EP3C5F256C8 对比
详细并排对比 EP3C5F256C6 出自 Intel 和 EP3C5F256C8 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3C5F256C6 | EP3C5F256C8 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $21.40 | $12.30 |
| Family | Cyclone III | — |
| Logic Elements (LE) | 5,136 | — |
| Logic Array Blocks (LABs) | 5136 / 342 (per ADatasheet summary) | — |
| Total Memory Bits | 423,936 bits | 423,936 |
| Embedded Memory | M9K blocks (per Cyclone III family) | — |
| Embedded 18x18 Multipliers | 23 | — |
| User I/Os | 182 | — |
| PLLs | 4 | Yes (general-purpose PLLs) |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.15 V to 1.25 V (typical 1.2 V) | — |
| Process Technology | 65 nm CMOS, low-k | 65 nm low-power CMOS |
| Maximum Operating Frequency | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] | — |
| 封装 | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch | — |
| 安装类型 | Surface Mount | Surface Mount |
| Operating Temperature (Commercial) | 0C to +85C (per device suffix C6) | — |
| Configuration Modes | AS, PS, JTAG | — |
| RoHS 状态 | Compliant (lead-free per FBGA package) | Lead Free, MS-034 |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Series | — | Cyclone III |
| Logic Elements | — | 5,136 |
| Number of LABs/CLBs | — | 321 |
| Number of Logic Elements/Cells | — | 5,136 |
| Maximum User I/O | — | 182 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| 工作温度 | — | -40°C to +125°C |
| Package Type | — | 256-LBGA (FineLine BGA) |
| Package Code | — | FBGA-256 |
| 电源电压 | — | [DATA_NEEDED: VCCINT/VCCA/VCCIO supply voltage values] |
| Configuration Memory | — | External flash via AS/PS/JTAG/FPP |
| Embedded Multipliers | — | Yes (18x18 hard multipliers) |
| MSL 等级 | — | [DATA_NEEDED: MSL rating] |