EP3C5F256C6N vs EP3C16F256I7N Vergleich
Detaillierter Direktvergleich von EP3C5F256C6N von Intel und EP3C16F256I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C5F256C6N | EP3C16F256I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $18,85 | $38,50 |
| Family | Cyclone III | Cyclone III |
| Series | EP3C5 | — |
| Logic Elements (LEs) | 5136 | 15408 |
| Logic Array Blocks (LABs) | 182 (per DigiKey listing) | 963 |
| Total Memory Bits | 423936 | 516096 |
| Embedded 18x18 Multipliers | 23 | 56 |
| PLLs | 2 | 4 |
| Maximum User I/Os | 182 | — |
| Core Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.2 V | — |
| Betriebstemperatur | 0 C to +85 C (commercial "C6" speed grade) | -40C to +100C (industrial, I7) |
| Gehäuse | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Montageart | Surface Mount | — |
| RoHS / Lead-Free | Lead-free (per distributor listings) | — |
| Configuration Modes | Serial, Parallel, JTAG, AS, PS | — |
| Embedded Memory | — | 56 M9K blocks (504 Kbit) |
| Maximum User I/O Pins | — | 168 |
| Supply Voltage (Core) | — | 1.2 V typical |
| Process Technology | — | TSMC 60 nm low-leakage |
| Configuration | — | SRAM-based, requires external config device (EPCS/EPCQ) |
| Lead-Free / Pb-Free | — | Yes (N suffix per JEDEC JESD97) |
| RoHS Compliance | — | Compliant |