EP3C5F256C8N vs EP3C5F256C6N Vergleich
Detaillierter Direktvergleich von EP3C5F256C8N von Intel und EP3C5F256C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C5F256C8N | EP3C5F256C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10,95 | $18,85 |
| Series | Cyclone III | EP3C5 |
| Device Family | Cyclone III (EP3C5) | — |
| Logic Elements (LEs) | 5,136 | 5136 |
| Embedded Memory (bits) | 423,936 | — |
| Embedded Memory (Kbits) | 414 Kbits | — |
| Embedded 18x18 Multipliers | 23 | 23 |
| PLLs | 4 | 2 |
| Maximum User I/Os | 182 | 182 |
| Core Voltage | 1.15 V to 1.25 V | 1.2 V |
| Betriebstemperatur | 0C to 85C (Commercial) | 0 C to +85 C (commercial "C6" speed grade) |
| Gehäuse | 256-ball FBGA (FineLine BGA) | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch |
| Process Technology | 65 nm | — |
| Configuration Memory | SRAM-based (in-system reprogrammable) | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| RoHS-Status | Lead Free (per Altera/Intel product page) | — |
| Montageart | Surface Mount | Surface Mount |
| Family | — | Cyclone III |
| Logic Array Blocks (LABs) | — | 182 (per DigiKey listing) |
| Total Memory Bits | — | 423936 |
| Core Process Technology | — | 65 nm CMOS |
| RoHS / Lead-Free | — | Lead-free (per distributor listings) |
| Configuration Modes | — | Serial, Parallel, JTAG, AS, PS |