EP3C5F256C8N vs EP3C5F256C6N Comparison
Detailed side-by-side comparison of EP3C5F256C8N by Intel and EP3C5F256C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C5F256C8N | EP3C5F256C6N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Series | Cyclone III | EP3C5 |
| Device Family | Cyclone III (EP3C5) | — |
| Logic Elements (LEs) | 5,136 | 5136 |
| Embedded Memory (bits) | 423,936 | — |
| Embedded Memory (Kbits) | 414 Kbits | — |
| Embedded 18x18 Multipliers | 23 | 23 |
| PLLs | 4 | 2 |
| Maximum User I/Os | 182 | 182 |
| Core Voltage | 1.15 V to 1.25 V | 1.2 V |
| Operating Temperature | 0C to 85C (Commercial) | 0 C to +85 C (commercial "C6" speed grade) |
| Package | 256-ball FBGA (FineLine BGA) | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch |
| Process Technology | 65 nm | — |
| Configuration Memory | SRAM-based (in-system reprogrammable) | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| RoHS Status | Lead Free (per Altera/Intel product page) | — |
| Mounting Type | Surface Mount | Surface Mount |
| Family | — | Cyclone III |
| Logic Array Blocks (LABs) | — | 182 (per DigiKey listing) |
| Total Memory Bits | — | 423936 |
| Core Process Technology | — | 65 nm CMOS |
| RoHS / Lead-Free | — | Lead-free (per distributor listings) |
| Configuration Modes | — | Serial, Parallel, JTAG, AS, PS |