EP3C5F256C8N vs EP3C5F256I7N Vergleich
Detaillierter Direktvergleich von EP3C5F256C8N von Intel und EP3C5F256I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C5F256C8N | EP3C5F256I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10,95 | $24,00 |
| Series | Cyclone III | — |
| Device Family | Cyclone III (EP3C5) | — |
| Logic Elements (LEs) | 5,136 | — |
| Embedded Memory (bits) | 423,936 | — |
| Embedded Memory (Kbits) | 414 Kbits | — |
| Embedded 18x18 Multipliers | 23 | — |
| PLLs | 4 | 2 |
| Maximum User I/Os | 182 | 182 |
| Core Voltage | 1.15 V to 1.25 V | — |
| Betriebstemperatur | 0C to 85C (Commercial) | -40C to +125C (Industrial) |
| Gehäuse | 256-ball FBGA (FineLine BGA) | 256-FBGA (FineLine BGA) |
| Process Technology | 65 nm | TSMC 65nm low-power |
| Configuration Memory | SRAM-based (in-system reprogrammable) | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| RoHS-Status | Lead Free (per Altera/Intel product page) | Compliant |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Family | — | Cyclone III |
| Logic Elements | — | 5,136 |
| Total Memory Bits | — | 423,936 bits |
| Embedded Multipliers (18x18) | — | 26 |
| Supply Voltage - Core | — | 1.15 V to 1.25 V (typical 1.2 V) |
| Configuration Modes | — | Active Serial, Passive Serial, JTAG, FPP |
| I/O Standards | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| MSL-Level | — | 3 (168 hours) |