EP3C5M164C7N vs EP3C5M164I7N Vergleich
Detaillierter Direktvergleich von EP3C5M164C7N von Intel und EP3C5M164I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C5M164C7N | EP3C5M164I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $17,20 | $23,40 |
| Family | Cyclone III | — |
| Device Logic Elements | 5,136 | — |
| Total Memory Bits | 423,936 bits | — |
| Embedded Memory | M9K blocks (RAM) | 423936 bits (approx. 414 Kbit) |
| Embedded Multipliers (18x18) | 23 | — |
| User I/O Pins | 106 (max) | 106 |
| Gehäuse | 164-ball MBGA (8x8 mm, 0.5 mm pitch) | 164-TFBGA (Micro BGA, M164, 8x8 mm) |
| Process Technology | 65 nm TSMC low-power | 60 nm TSMC low-k |
| PLLs | 4 | 2 |
| Betriebstemperatur | 0C to +85C (commercial) | — |
| Speed Grade | 7 | 7 |
| Configuration Mode | JTAG / Active Serial (AS) / Passive Serial (PS) | — |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | 3 | [DATA_NEEDED: MSL level] |
| RoHS-Status | Compliant | Compliant |
| Logic Elements (LE) | — | 5136 |
| Embedded Multipliers | — | 23 x 18x18 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Temperature Grade | — | Industrial (-40C to +100C junction) |
| Ball Pitch | — | 0.5 mm |
| Configuration Modes | — | PS, FPP, AS |
| External Memory Support | — | DDR, DDR2, SDR, QDRII+ SRAM |
| I/O Standards | — | LVDS, SSTL, HSTL, LVCMOS |
| Betriebs-Sperrschichttemperatur | — | -40C to +100C |