EP3C5M164C7N vs EP3C5M164I7N Comparison
Detailed side-by-side comparison of EP3C5M164C7N by Intel and EP3C5M164I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C5M164C7N | EP3C5M164I7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | Cyclone III | — |
| Device Logic Elements | 5,136 | — |
| Total Memory Bits | 423,936 bits | — |
| Embedded Memory | M9K blocks (RAM) | 423936 bits (approx. 414 Kbit) |
| Embedded Multipliers (18x18) | 23 | — |
| User I/O Pins | 106 (max) | 106 |
| Package | 164-ball MBGA (8x8 mm, 0.5 mm pitch) | 164-TFBGA (Micro BGA, M164, 8x8 mm) |
| Process Technology | 65 nm TSMC low-power | 60 nm TSMC low-k |
| PLLs | 4 | 2 |
| Operating Temperature | 0C to +85C (commercial) | — |
| Speed Grade | 7 | 7 |
| Configuration Mode | JTAG / Active Serial (AS) / Passive Serial (PS) | — |
| Mounting Type | Surface Mount | Surface Mount |
| MSL Level | 3 | [DATA_NEEDED: MSL level] |
| RoHS Status | Compliant | Compliant |
| Logic Elements (LE) | — | 5136 |
| Embedded Multipliers | — | 23 x 18x18 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Temperature Grade | — | Industrial (-40C to +100C junction) |
| Ball Pitch | — | 0.5 mm |
| Configuration Modes | — | PS, FPP, AS |
| External Memory Support | — | DDR, DDR2, SDR, QDRII+ SRAM |
| I/O Standards | — | LVDS, SSTL, HSTL, LVCMOS |
| Operating Junction Temperature | — | -40C to +100C |