EP3C5U256C8 vs EP3C5U256A7N Vergleich
Detaillierter Direktvergleich von EP3C5U256C8 von Intel und EP3C5U256A7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C5U256C8 | EP3C5U256A7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $17,20 | $16,20 |
| Series | Cyclone® III | Cyclone III |
| Logic Elements | 5,136 | 5,136 LE |
| Total Memory Bits | 423,936 | — |
| Number of Logic Array Blocks (LABs) | 182 | — |
| Number of I/O Pins | 182 (maximum user I/O) | — |
| Embedded 18x18 Multipliers | 23 | — |
| PLLs | 2 | — |
| Gehäuse | 256-LFBGA (UBGA) | — |
| Package Code | LFBGA-256, 17x17 mm | — |
| Speed Grade | 8 (commercial) | -7 |
| Betriebstemperatur | 0C to +85C (commercial grade) | — |
| Core Voltage | 1.0 V to 1.2 V (1.2 V nominal) | — |
| I/O Voltage Support | LVDS, LVCMOS, SSTL, HSTL | — |
| Configuration Modes | JTAG, Active Serial, Active Parallel, Passive Serial | — |
| Montageart | Surface Mount (BGA) | — |
| RoHS-Status | Compliant | Compliant |
| Process Technology | 60 nm low-power CMOS | — |
| Embedded Memory | — | 414 kbit (423,936 bits) |
| Number of I/Os | — | 182 |
| Operating Supply Voltage (Core) | — | 1.15 V to 1.25 V |
| Montagestil | — | SMD/SMT |
| Gehäuse / Bauform | — | BGA-256 (U256 Ultra FineLine) |
| Packaging | — | Tray |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +125 C (Automotive grade) |
| Temperature Grade | — | Automotive |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Number of PLLs | — | 4 |
| Process Node | — | 60 nm low-power CMOS |