EP3C5U256C8 vs EP3C5U256A7N Comparación
Comparación detallada lado a lado de EP3C5U256C8 por Intel y EP3C5U256A7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C5U256C8 | EP3C5U256A7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,20 | $16,20 |
| Series | Cyclone® III | Cyclone III |
| Logic Elements | 5,136 | 5,136 LE |
| Total Memory Bits | 423,936 | — |
| Number of Logic Array Blocks (LABs) | 182 | — |
| Number of I/O Pins | 182 (maximum user I/O) | — |
| Embedded 18x18 Multipliers | 23 | — |
| PLLs | 2 | — |
| Encapsulado | 256-LFBGA (UBGA) | — |
| Package Code | LFBGA-256, 17x17 mm | — |
| Speed Grade | 8 (commercial) | -7 |
| Temperatura de funcionamiento | 0C to +85C (commercial grade) | — |
| Core Voltage | 1.0 V to 1.2 V (1.2 V nominal) | — |
| I/O Voltage Support | LVDS, LVCMOS, SSTL, HSTL | — |
| Configuration Modes | JTAG, Active Serial, Active Parallel, Passive Serial | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Estado RoHS | Compliant | Compliant |
| Process Technology | 60 nm low-power CMOS | — |
| Embedded Memory | — | 414 kbit (423,936 bits) |
| Number of I/Os | — | 182 |
| Operating Supply Voltage (Core) | — | 1.15 V to 1.25 V |
| Estilo de montaje | — | SMD/SMT |
| Encapsulado / Carcasa | — | BGA-256 (U256 Ultra FineLine) |
| Packaging | — | Tray |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +125 C (Automotive grade) |
| Temperature Grade | — | Automotive |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Number of PLLs | — | 4 |
| Process Node | — | 60 nm low-power CMOS |