EP3C80F484I7N vs EP3CLS100F484I7 Vergleich
Detaillierter Direktvergleich von EP3C80F484I7N von Intel und EP3CLS100F484I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C80F484I7N | EP3CLS100F484I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $286,91 | $113,60 |
| Series | Cyclone III | — |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 81,264 | — |
| Embedded Memory (RAM bits) | 2,810,880 | — |
| User I/O Count | 295 | — |
| Number of Logic Blocks / CLBs | 81,264 | — |
| Core Supply Voltage VCCINT | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| I/O Supply Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Maximum Internal Clock Frequency | 472.5 MHz | — |
| Number of PLLs | 4 | — |
| Number of 18x18 Multipliers | 244 | — |
| Process Technology | 60 nm low-power CMOS, SRAM-based | TSMC 65 nm low-power (LP) |
| Operating Temperature (Junction) | -40C to +100C (industrial I7 grade) | — |
| Gehäuse | 484-ball FBGA, 23 x 23 mm, 1.0 mm pitch | 484-ball FBGA (FineLine BGA) |
| Montageart | Surface Mount | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| MSL-Level | 3 | — |
| Configuration Method | AS / PS / JTAG / FPP | Serial/Parallel, AES-256 encrypted (LS feature) |
| Device Family | — | Cyclone III LS |
| Logic Elements (LE) | — | 100,448 |
| Logic Array Blocks (LABs) | — | 278 |
| Total Embedded Memory Bits | — | 4,451,328 bits |
| Embedded Memory (M9K Blocks) | — | 610 (per datasheet family) |
| DSP Blocks (18x18 Multipliers) | — | 66 |
| 18x18 Hardware Multipliers | — | 16 dedicated |
| PLLs | — | 4 |
| Maximum User I/Os | — | 429 |
| Core Supply Voltage | — | 1.2 V |
| I/O Standards Supported | — | LVDS, LVCMOS, LVTTL, SSTL, HSTL |
| Betriebstemperaturbereich | — | -40C to +85C (Industrial) |
| External Memory Support | — | DDR, DDR2, QDRII, RLDRAM II |