EP3C80F484I7N vs EP3CLS100F484I7 Comparação
Comparação detalhada lado a lado de EP3C80F484I7N por Intel e EP3CLS100F484I7 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP3C80F484I7N | EP3CLS100F484I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $286,91 | $113,60 |
| Series | Cyclone III | — |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 81,264 | — |
| Embedded Memory (RAM bits) | 2,810,880 | — |
| User I/O Count | 295 | — |
| Number of Logic Blocks / CLBs | 81,264 | — |
| Core Supply Voltage VCCINT | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| I/O Supply Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Maximum Internal Clock Frequency | 472.5 MHz | — |
| Number of PLLs | 4 | — |
| Number of 18x18 Multipliers | 244 | — |
| Process Technology | 60 nm low-power CMOS, SRAM-based | TSMC 65 nm low-power (LP) |
| Operating Temperature (Junction) | -40C to +100C (industrial I7 grade) | — |
| Encapsulamento | 484-ball FBGA, 23 x 23 mm, 1.0 mm pitch | 484-ball FBGA (FineLine BGA) |
| Tipo de montagem | Surface Mount | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Nível MSL | 3 | — |
| Configuration Method | AS / PS / JTAG / FPP | Serial/Parallel, AES-256 encrypted (LS feature) |
| Device Family | — | Cyclone III LS |
| Logic Elements (LE) | — | 100,448 |
| Logic Array Blocks (LABs) | — | 278 |
| Total Embedded Memory Bits | — | 4,451,328 bits |
| Embedded Memory (M9K Blocks) | — | 610 (per datasheet family) |
| DSP Blocks (18x18 Multipliers) | — | 66 |
| 18x18 Hardware Multipliers | — | 16 dedicated |
| PLLs | — | 4 |
| Maximum User I/Os | — | 429 |
| Core Supply Voltage | — | 1.2 V |
| I/O Standards Supported | — | LVDS, LVCMOS, LVTTL, SSTL, HSTL |
| Faixa de temperatura de operação | — | -40C to +85C (Industrial) |
| External Memory Support | — | DDR, DDR2, QDRII, RLDRAM II |