EP3C80F484I7N vs EP3CLS100F484I7 对比
详细并排对比 EP3C80F484I7N 出自 Intel 和 EP3CLS100F484I7 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3C80F484I7N | EP3CLS100F484I7 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $286.91 | $113.60 |
| Series | Cyclone III | — |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 81,264 | — |
| Embedded Memory (RAM bits) | 2,810,880 | — |
| User I/O Count | 295 | — |
| Number of Logic Blocks / CLBs | 81,264 | — |
| Core Supply Voltage VCCINT | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| I/O Supply Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Maximum Internal Clock Frequency | 472.5 MHz | — |
| Number of PLLs | 4 | — |
| Number of 18x18 Multipliers | 244 | — |
| Process Technology | 60 nm low-power CMOS, SRAM-based | TSMC 65 nm low-power (LP) |
| Operating Temperature (Junction) | -40C to +100C (industrial I7 grade) | — |
| 封装 | 484-ball FBGA, 23 x 23 mm, 1.0 mm pitch | 484-ball FBGA (FineLine BGA) |
| 安装类型 | Surface Mount | — |
| RoHS 状态 | Compliant | Compliant |
| Lead-Free | Yes | — |
| MSL 等级 | 3 | — |
| Configuration Method | AS / PS / JTAG / FPP | Serial/Parallel, AES-256 encrypted (LS feature) |
| Device Family | — | Cyclone III LS |
| Logic Elements (LE) | — | 100,448 |
| Logic Array Blocks (LABs) | — | 278 |
| Total Embedded Memory Bits | — | 4,451,328 bits |
| Embedded Memory (M9K Blocks) | — | 610 (per datasheet family) |
| DSP Blocks (18x18 Multipliers) | — | 66 |
| 18x18 Hardware Multipliers | — | 16 dedicated |
| PLLs | — | 4 |
| Maximum User I/Os | — | 429 |
| Core Supply Voltage | — | 1.2 V |
| I/O Standards Supported | — | LVDS, LVCMOS, LVTTL, SSTL, HSTL |
| 工作温度范围 | — | -40C to +85C (Industrial) |
| External Memory Support | — | DDR, DDR2, QDRII, RLDRAM II |