EP3CLS100F484C7N vs EP3CLS100F484C7 Vergleich
Detaillierter Direktvergleich von EP3CLS100F484C7N von Intel und EP3CLS100F484C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS100F484C7N | EP3CLS100F484C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $495,80 | $62,80 |
| Family | Cyclone III LS | Cyclone III LS |
| Logic Elements | 100,448 | — |
| Embedded Memory (bits) | 4,451,328 | — |
| User I/O Pins | 278 | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: DSP block count] | — |
| PLLs | 4 | 4 |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| Process Technology | 65 nm low-power (TSMC) | 65 nm |
| Core Supply Voltage | 1.2 V | — |
| Operating Temperature (junction) | 0°C to +85°C (commercial) | — |
| Speed Grade | C7 | — |
| Gehäuse | 484-ball FineLine BGA (FBGA-484) | 484-ball FBGA (Fine-Pitch BGA) |
| Ball Pitch | 1.0 mm | — |
| Package Dimensions | [DATA_NEEDED: package body dimensions] | — |
| Configuration Method | SRAM-based (volatile), via EPCS/JTAG/parallel flash | — |
| Security Features | Bitstream encryption, JTAG tamper protection | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant (lead-free, N suffix) | Compliant |
| Design Software | Quartus II / Intel Quartus Prime | Quartus II / Quartus Prime |
| Logic Elements (LE) | — | 100,448 |
| Embedded Memory Bits | — | 4,451,328 |
| Maximum User I/Os | — | 278 |
| Logic Blocks / Logic Cells | — | 47 |
| Core Voltage | — | 1.2 V |
| Maximum Internal Frequency | — | 437.5 MHz |
| Operating Temperature Grade | — | Commercial |
| Configuration Memory | — | SRAM-based (volatile, requires external config device) |