EP3CLS100F484C7N vs EP3CLS100F484C7 Comparaison
Comparaison détaillée côte à côte de EP3CLS100F484C7N par Intel et EP3CLS100F484C7 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3CLS100F484C7N | EP3CLS100F484C7 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $495,80 | $62,80 |
| Family | Cyclone III LS | Cyclone III LS |
| Logic Elements | 100,448 | — |
| Embedded Memory (bits) | 4,451,328 | — |
| User I/O Pins | 278 | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: DSP block count] | — |
| PLLs | 4 | 4 |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| Process Technology | 65 nm low-power (TSMC) | 65 nm |
| Core Supply Voltage | 1.2 V | — |
| Operating Temperature (junction) | 0°C to +85°C (commercial) | — |
| Speed Grade | C7 | — |
| Boîtier | 484-ball FineLine BGA (FBGA-484) | 484-ball FBGA (Fine-Pitch BGA) |
| Ball Pitch | 1.0 mm | — |
| Package Dimensions | [DATA_NEEDED: package body dimensions] | — |
| Configuration Method | SRAM-based (volatile), via EPCS/JTAG/parallel flash | — |
| Security Features | Bitstream encryption, JTAG tamper protection | — |
| Type de montage | Surface Mount | Surface Mount |
| Statut RoHS | Compliant (lead-free, N suffix) | Compliant |
| Design Software | Quartus II / Intel Quartus Prime | Quartus II / Quartus Prime |
| Logic Elements (LE) | — | 100,448 |
| Embedded Memory Bits | — | 4,451,328 |
| Maximum User I/Os | — | 278 |
| Logic Blocks / Logic Cells | — | 47 |
| Core Voltage | — | 1.2 V |
| Maximum Internal Frequency | — | 437.5 MHz |
| Operating Temperature Grade | — | Commercial |
| Configuration Memory | — | SRAM-based (volatile, requires external config device) |