EP3CLS100F484C7N vs EP3CLS100F484C7 Comparação
Comparação detalhada lado a lado de EP3CLS100F484C7N por Intel e EP3CLS100F484C7 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP3CLS100F484C7N | EP3CLS100F484C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $495,80 | $62,80 |
| Family | Cyclone III LS | Cyclone III LS |
| Logic Elements | 100,448 | — |
| Embedded Memory (bits) | 4,451,328 | — |
| User I/O Pins | 278 | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: DSP block count] | — |
| PLLs | 4 | 4 |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| Process Technology | 65 nm low-power (TSMC) | 65 nm |
| Core Supply Voltage | 1.2 V | — |
| Operating Temperature (junction) | 0°C to +85°C (commercial) | — |
| Speed Grade | C7 | — |
| Encapsulamento | 484-ball FineLine BGA (FBGA-484) | 484-ball FBGA (Fine-Pitch BGA) |
| Ball Pitch | 1.0 mm | — |
| Package Dimensions | [DATA_NEEDED: package body dimensions] | — |
| Configuration Method | SRAM-based (volatile), via EPCS/JTAG/parallel flash | — |
| Security Features | Bitstream encryption, JTAG tamper protection | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Status RoHS | Compliant (lead-free, N suffix) | Compliant |
| Design Software | Quartus II / Intel Quartus Prime | Quartus II / Quartus Prime |
| Logic Elements (LE) | — | 100,448 |
| Embedded Memory Bits | — | 4,451,328 |
| Maximum User I/Os | — | 278 |
| Logic Blocks / Logic Cells | — | 47 |
| Core Voltage | — | 1.2 V |
| Maximum Internal Frequency | — | 437.5 MHz |
| Operating Temperature Grade | — | Commercial |
| Configuration Memory | — | SRAM-based (volatile, requires external config device) |