EP3CLS100F484C8N vs EP3CLS100F484I7 Vergleich
Detaillierter Direktvergleich von EP3CLS100F484C8N von Intel und EP3CLS100F484I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS100F484C8N | EP3CLS100F484I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $115,40 | $113,60 |
| Series | Cyclone® III LS | — |
| Family Name | Cyclone III LS | — |
| Logic Elements | 100,448 | — |
| Embedded Memory Bits | 4,451,328 bits | — |
| Number of I/O | 278 (maximum user I/O) | — |
| Number of Logic Blocks / Cells | 47 (logic blocks reported by DigChip snapshot) | — |
| Package Type | FBGA-484 (FineLine BGA, lead-free) | — |
| Pin / Ball Count | 484 | — |
| Supply Voltage (Core) | 1.2 V | — |
| Speed Grade | C8 (commercial, fastest) | — |
| Process Technology | TSMC 65 nm low-power (LP) | TSMC 65 nm low-power (LP) |
| Betriebstemperatur | 0°C to +85°C (commercial grade) | — |
| Montageart | Surface Mount | — |
| Configuration Interface | JTAG, Passive Serial, Active Serial | — |
| Bitstream Encryption | AES-128 (Cyclone III LS security feature) | — |
| RoHS-Status | Compliant (Pb-free, 'N' suffix) | Compliant |
| MSL-Level | 3 (per JEDEC J-STD-020, typical for BGA) | — |
| Embedded Multipliers (18x18) | 4,488 (per Cyclone III LS family handbook, 100K LE tier) | — |
| PLLs | 4 (per Cyclone III LS family) | 4 |
| DSP Blocks | Integrated (multiplier-based) | — |
| Device Family | — | Cyclone III LS |
| Logic Elements (LE) | — | 100,448 |
| Logic Array Blocks (LABs) | — | 278 |
| Total Embedded Memory Bits | — | 4,451,328 bits |
| Embedded Memory (M9K Blocks) | — | 610 (per datasheet family) |
| DSP Blocks (18x18 Multipliers) | — | 66 |
| 18x18 Hardware Multipliers | — | 16 dedicated |
| Maximum User I/Os | — | 429 |
| Gehäuse | — | 484-ball FBGA (FineLine BGA) |
| Core Supply Voltage | — | 1.2 V |
| I/O Standards Supported | — | LVDS, LVCMOS, LVTTL, SSTL, HSTL |
| Betriebstemperaturbereich | — | -40C to +85C (Industrial) |
| Configuration Method | — | Serial/Parallel, AES-256 encrypted (LS feature) |
| External Memory Support | — | DDR, DDR2, QDRII, RLDRAM II |