EP3CLS100F484C8N vs EP3CLS100F484I7 Comparação
Comparação detalhada lado a lado de EP3CLS100F484C8N por Intel e EP3CLS100F484I7 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP3CLS100F484C8N | EP3CLS100F484I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $115,40 | $113,60 |
| Series | Cyclone® III LS | — |
| Family Name | Cyclone III LS | — |
| Logic Elements | 100,448 | — |
| Embedded Memory Bits | 4,451,328 bits | — |
| Number of I/O | 278 (maximum user I/O) | — |
| Number of Logic Blocks / Cells | 47 (logic blocks reported by DigChip snapshot) | — |
| Package Type | FBGA-484 (FineLine BGA, lead-free) | — |
| Pin / Ball Count | 484 | — |
| Supply Voltage (Core) | 1.2 V | — |
| Speed Grade | C8 (commercial, fastest) | — |
| Process Technology | TSMC 65 nm low-power (LP) | TSMC 65 nm low-power (LP) |
| Temperatura de operação | 0°C to +85°C (commercial grade) | — |
| Tipo de montagem | Surface Mount | — |
| Configuration Interface | JTAG, Passive Serial, Active Serial | — |
| Bitstream Encryption | AES-128 (Cyclone III LS security feature) | — |
| Status RoHS | Compliant (Pb-free, 'N' suffix) | Compliant |
| Nível MSL | 3 (per JEDEC J-STD-020, typical for BGA) | — |
| Embedded Multipliers (18x18) | 4,488 (per Cyclone III LS family handbook, 100K LE tier) | — |
| PLLs | 4 (per Cyclone III LS family) | 4 |
| DSP Blocks | Integrated (multiplier-based) | — |
| Device Family | — | Cyclone III LS |
| Logic Elements (LE) | — | 100,448 |
| Logic Array Blocks (LABs) | — | 278 |
| Total Embedded Memory Bits | — | 4,451,328 bits |
| Embedded Memory (M9K Blocks) | — | 610 (per datasheet family) |
| DSP Blocks (18x18 Multipliers) | — | 66 |
| 18x18 Hardware Multipliers | — | 16 dedicated |
| Maximum User I/Os | — | 429 |
| Encapsulamento | — | 484-ball FBGA (FineLine BGA) |
| Core Supply Voltage | — | 1.2 V |
| I/O Standards Supported | — | LVDS, LVCMOS, LVTTL, SSTL, HSTL |
| Faixa de temperatura de operação | — | -40C to +85C (Industrial) |
| Configuration Method | — | Serial/Parallel, AES-256 encrypted (LS feature) |
| External Memory Support | — | DDR, DDR2, QDRII, RLDRAM II |