EP3CLS100F484C8N vs EP3CLS200F484C8N Vergleich
Detaillierter Direktvergleich von EP3CLS100F484C8N von Intel und EP3CLS200F484C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS100F484C8N | EP3CLS200F484C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $115,40 | $1.245,00 |
| Series | Cyclone® III LS | Cyclone III LS |
| Family Name | Cyclone III LS | — |
| Logic Elements | 100,448 | 198,464 |
| Embedded Memory Bits | 4,451,328 bits | — |
| Number of I/O | 278 (maximum user I/O) | — |
| Number of Logic Blocks / Cells | 47 (logic blocks reported by DigChip snapshot) | — |
| Package Type | FBGA-484 (FineLine BGA, lead-free) | — |
| Pin / Ball Count | 484 | — |
| Supply Voltage (Core) | 1.2 V | — |
| Speed Grade | C8 (commercial, fastest) | 8 (slowest) |
| Process Technology | TSMC 65 nm low-power (LP) | 65 nm CMOS, low-leakage |
| Betriebstemperatur | 0°C to +85°C (commercial grade) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Configuration Interface | JTAG, Passive Serial, Active Serial | — |
| Bitstream Encryption | AES-128 (Cyclone III LS security feature) | AES-128 (256-bit key via separate license) |
| RoHS-Status | Compliant (Pb-free, 'N' suffix) | Compliant |
| MSL-Level | 3 (per JEDEC J-STD-020, typical for BGA) | — |
| Embedded Multipliers (18x18) | 4,488 (per Cyclone III LS family handbook, 100K LE tier) | 396 |
| PLLs | 4 (per Cyclone III LS family) | — |
| DSP Blocks | Integrated (multiplier-based) | — |
| Family | — | Cyclone® III LS |
| Embedded Memory | — | 8,211,456 bits (8.21 Mbit) |
| Logic Array Blocks (LABs) | — | [DATA_NEEDED: exact LAB count] |
| User I/O Pins | — | 210 |
| Number of PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| Maximum Operating Frequency | — | 402 MHz (fabric) |
| Gehäuse | — | 484-ball FBGA (FineLine BGA), 23 x 23 mm |
| Temperature Grade | — | Commercial (0C to +85C TJ) |
| Configuration Mode | — | Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG |