EP3CLS100F484C8N vs EP3CLS200F484C8N Comparación
Comparación detallada lado a lado de EP3CLS100F484C8N por Intel y EP3CLS200F484C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS100F484C8N | EP3CLS200F484C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $115,40 | $1.245,00 |
| Series | Cyclone® III LS | Cyclone III LS |
| Family Name | Cyclone III LS | — |
| Logic Elements | 100,448 | 198,464 |
| Embedded Memory Bits | 4,451,328 bits | — |
| Number of I/O | 278 (maximum user I/O) | — |
| Number of Logic Blocks / Cells | 47 (logic blocks reported by DigChip snapshot) | — |
| Package Type | FBGA-484 (FineLine BGA, lead-free) | — |
| Pin / Ball Count | 484 | — |
| Supply Voltage (Core) | 1.2 V | — |
| Speed Grade | C8 (commercial, fastest) | 8 (slowest) |
| Process Technology | TSMC 65 nm low-power (LP) | 65 nm CMOS, low-leakage |
| Temperatura de funcionamiento | 0°C to +85°C (commercial grade) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Configuration Interface | JTAG, Passive Serial, Active Serial | — |
| Bitstream Encryption | AES-128 (Cyclone III LS security feature) | AES-128 (256-bit key via separate license) |
| Estado RoHS | Compliant (Pb-free, 'N' suffix) | Compliant |
| Nivel MSL | 3 (per JEDEC J-STD-020, typical for BGA) | — |
| Embedded Multipliers (18x18) | 4,488 (per Cyclone III LS family handbook, 100K LE tier) | 396 |
| PLLs | 4 (per Cyclone III LS family) | — |
| DSP Blocks | Integrated (multiplier-based) | — |
| Family | — | Cyclone® III LS |
| Embedded Memory | — | 8,211,456 bits (8.21 Mbit) |
| Logic Array Blocks (LABs) | — | [DATA_NEEDED: exact LAB count] |
| User I/O Pins | — | 210 |
| Number of PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| Maximum Operating Frequency | — | 402 MHz (fabric) |
| Encapsulado | — | 484-ball FBGA (FineLine BGA), 23 x 23 mm |
| Temperature Grade | — | Commercial (0C to +85C TJ) |
| Configuration Mode | — | Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG |