EP3CLS100F484C8N vs EP3CLS200F484C8N Comparison
Detailed side-by-side comparison of EP3CLS100F484C8N by Intel and EP3CLS200F484C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3CLS100F484C8N | EP3CLS200F484C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $115.40 | $1,245.00 |
| Series | Cycloneยฎ III LS | Cyclone III LS |
| Family Name | Cyclone III LS | โ |
| Logic Elements | 100,448 | 198,464 |
| Embedded Memory Bits | 4,451,328 bits | โ |
| Number of I/O | 278 (maximum user I/O) | โ |
| Number of Logic Blocks / Cells | 47 (logic blocks reported by DigChip snapshot) | โ |
| Package Type | FBGA-484 (FineLine BGA, lead-free) | โ |
| Pin / Ball Count | 484 | โ |
| Supply Voltage (Core) | 1.2 V | โ |
| Speed Grade | C8 (commercial, fastest) | 8 (slowest) |
| Process Technology | TSMC 65 nm low-power (LP) | 65 nm CMOS, low-leakage |
| Operating Temperature | 0ยฐC to +85ยฐC (commercial grade) | โ |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Configuration Interface | JTAG, Passive Serial, Active Serial | โ |
| Bitstream Encryption | AES-128 (Cyclone III LS security feature) | AES-128 (256-bit key via separate license) |
| RoHS Status | Compliant (Pb-free, 'N' suffix) | Compliant |
| MSL Level | 3 (per JEDEC J-STD-020, typical for BGA) | โ |
| Embedded Multipliers (18x18) | 4,488 (per Cyclone III LS family handbook, 100K LE tier) | 396 |
| PLLs | 4 (per Cyclone III LS family) | โ |
| DSP Blocks | Integrated (multiplier-based) | โ |
| Family | โ | Cycloneยฎ III LS |
| Embedded Memory | โ | 8,211,456 bits (8.21 Mbit) |
| Logic Array Blocks (LABs) | โ | [DATA_NEEDED: exact LAB count] |
| User I/O Pins | โ | 210 |
| Number of PLLs | โ | 4 |
| Global Clock Networks | โ | 20 |
| Core Voltage | โ | 1.2 V |
| Maximum Operating Frequency | โ | 402 MHz (fabric) |
| Package | โ | 484-ball FBGA (FineLine BGA), 23 x 23 mm |
| Temperature Grade | โ | Commercial (0C to +85C TJ) |
| Configuration Mode | โ | Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG |