EP3CLS100F484I7 vs EP3CLS100F484C7 Vergleich
Detaillierter Direktvergleich von EP3CLS100F484I7 von Intel und EP3CLS100F484C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS100F484I7 | EP3CLS100F484C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $113,60 | $62,80 |
| Device Family | Cyclone III LS | — |
| Logic Elements (LE) | 100,448 | 100,448 |
| Logic Array Blocks (LABs) | 278 | — |
| Total Embedded Memory Bits | 4,451,328 bits | — |
| Embedded Memory (M9K Blocks) | 610 (per datasheet family) | — |
| DSP Blocks (18x18 Multipliers) | 66 | — |
| 18x18 Hardware Multipliers | 16 dedicated | — |
| PLLs | 4 | 4 |
| Maximum User I/Os | 429 | 278 |
| Gehäuse | 484-ball FBGA (FineLine BGA) | 484-ball FBGA (Fine-Pitch BGA) |
| Core Supply Voltage | 1.2 V | — |
| I/O Standards Supported | LVDS, LVCMOS, LVTTL, SSTL, HSTL | — |
| Betriebstemperaturbereich | -40C to +85C (Industrial) | — |
| Process Technology | TSMC 65 nm low-power (LP) | 65 nm |
| Configuration Method | Serial/Parallel, AES-256 encrypted (LS feature) | — |
| External Memory Support | DDR, DDR2, QDRII, RLDRAM II | — |
| RoHS-Status | Compliant | Compliant |
| Family | — | Cyclone III LS |
| Embedded Memory Bits | — | 4,451,328 |
| Logic Blocks / Logic Cells | — | 47 |
| Core Voltage | — | 1.2 V |
| Maximum Internal Frequency | — | 437.5 MHz |
| Montageart | — | Surface Mount |
| Operating Temperature Grade | — | Commercial |
| Configuration Memory | — | SRAM-based (volatile, requires external config device) |
| Design Software | — | Quartus II / Quartus Prime |