EP3CLS100F484I7 vs EP3CLS100F484C7 Comparación
Comparación detallada lado a lado de EP3CLS100F484I7 por Intel y EP3CLS100F484C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS100F484I7 | EP3CLS100F484C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $113,60 | $62,80 |
| Device Family | Cyclone III LS | — |
| Logic Elements (LE) | 100,448 | 100,448 |
| Logic Array Blocks (LABs) | 278 | — |
| Total Embedded Memory Bits | 4,451,328 bits | — |
| Embedded Memory (M9K Blocks) | 610 (per datasheet family) | — |
| DSP Blocks (18x18 Multipliers) | 66 | — |
| 18x18 Hardware Multipliers | 16 dedicated | — |
| PLLs | 4 | 4 |
| Maximum User I/Os | 429 | 278 |
| Encapsulado | 484-ball FBGA (FineLine BGA) | 484-ball FBGA (Fine-Pitch BGA) |
| Core Supply Voltage | 1.2 V | — |
| I/O Standards Supported | LVDS, LVCMOS, LVTTL, SSTL, HSTL | — |
| Rango de temperatura de funcionamiento | -40C to +85C (Industrial) | — |
| Process Technology | TSMC 65 nm low-power (LP) | 65 nm |
| Configuration Method | Serial/Parallel, AES-256 encrypted (LS feature) | — |
| External Memory Support | DDR, DDR2, QDRII, RLDRAM II | — |
| Estado RoHS | Compliant | Compliant |
| Family | — | Cyclone III LS |
| Embedded Memory Bits | — | 4,451,328 |
| Logic Blocks / Logic Cells | — | 47 |
| Core Voltage | — | 1.2 V |
| Maximum Internal Frequency | — | 437.5 MHz |
| Tipo de montaje | — | Surface Mount |
| Operating Temperature Grade | — | Commercial |
| Configuration Memory | — | SRAM-based (volatile, requires external config device) |
| Design Software | — | Quartus II / Quartus Prime |