EP3CLS150F780I7N vs EP3CLS100F780C8N Vergleich
Detaillierter Direktvergleich von EP3CLS150F780I7N von Intel und EP3CLS100F780C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS150F780I7N | EP3CLS100F780C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $128,00 | $105,80 |
| Family | Cyclone III LS | — |
| Logic Elements | 150,848 | — |
| Embedded Memory Bits | 6,137,856 | — |
| Maximum User I/O | 413 | 429 |
| Gehäuse | 780-FBGA (FineLine BGA) | 780-ball FBGA (FineLine BGA) |
| Pins / Balls | 780 | — |
| Supply Voltage (Core) | 1.2 V | — |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS |
| Maximum Internal Frequency | 437 MHz | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Number of PLLs | 4 | 4 |
| Configuration Method | JTAG, Passive Serial (EPCS), Active Serial | — |
| Security Features | AES-128/256 bitstream encryption, JTAG security, tamper detection | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL-Level | 3 | — |
| RoHS-Status | Compliant | Compliant |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Device Family | — | Cyclone III LS |
| Logic Elements (LE) | — | 100,448 |
| Total Memory Bits | — | 4,451,328 |
| Embedded Memory Blocks | — | M9K + M144K |
| Logic Array Blocks (LAB) | — | 6,278 |
| Core Supply Voltage (VCCINT) | — | 1.2 V |
| Analog Supply (VCCA) | — | 2.5 V |
| Maximum Embedded Multipliers (18x18) | — | 244 |
| Package Dimensions | — | 29 mm x 29 mm, 1.0 mm ball pitch |
| Operating Temperature (Commercial) | — | 0C to +85C |
| Configuration Schemes | — | AS, PS, PP, JTAG |
| Lead-Free | — | Yes |