EP3CLS150F780I7N vs EP3CLS100F780C8N Comparaison
Comparaison détaillée côte à côte de EP3CLS150F780I7N par Intel et EP3CLS100F780C8N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3CLS150F780I7N | EP3CLS100F780C8N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $128,00 | $105,80 |
| Family | Cyclone III LS | — |
| Logic Elements | 150,848 | — |
| Embedded Memory Bits | 6,137,856 | — |
| Maximum User I/O | 413 | 429 |
| Boîtier | 780-FBGA (FineLine BGA) | 780-ball FBGA (FineLine BGA) |
| Pins / Balls | 780 | — |
| Supply Voltage (Core) | 1.2 V | — |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS |
| Maximum Internal Frequency | 437 MHz | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Number of PLLs | 4 | 4 |
| Configuration Method | JTAG, Passive Serial (EPCS), Active Serial | — |
| Security Features | AES-128/256 bitstream encryption, JTAG security, tamper detection | — |
| Type de montage | Surface Mount (BGA) | Surface Mount (BGA) |
| Niveau MSL | 3 | — |
| Statut RoHS | Compliant | Compliant |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Device Family | — | Cyclone III LS |
| Logic Elements (LE) | — | 100,448 |
| Total Memory Bits | — | 4,451,328 |
| Embedded Memory Blocks | — | M9K + M144K |
| Logic Array Blocks (LAB) | — | 6,278 |
| Core Supply Voltage (VCCINT) | — | 1.2 V |
| Analog Supply (VCCA) | — | 2.5 V |
| Maximum Embedded Multipliers (18x18) | — | 244 |
| Package Dimensions | — | 29 mm x 29 mm, 1.0 mm ball pitch |
| Operating Temperature (Commercial) | — | 0C to +85C |
| Configuration Schemes | — | AS, PS, PP, JTAG |
| Lead-Free | — | Yes |