EP3CLS150F780I7N vs EP3CLS100F780C8N Comparación
Comparación detallada lado a lado de EP3CLS150F780I7N por Intel y EP3CLS100F780C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS150F780I7N | EP3CLS100F780C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $128,00 | $105,80 |
| Family | Cyclone III LS | — |
| Logic Elements | 150,848 | — |
| Embedded Memory Bits | 6,137,856 | — |
| Maximum User I/O | 413 | 429 |
| Encapsulado | 780-FBGA (FineLine BGA) | 780-ball FBGA (FineLine BGA) |
| Pins / Balls | 780 | — |
| Supply Voltage (Core) | 1.2 V | — |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS |
| Maximum Internal Frequency | 437 MHz | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Number of PLLs | 4 | 4 |
| Configuration Method | JTAG, Passive Serial (EPCS), Active Serial | — |
| Security Features | AES-128/256 bitstream encryption, JTAG security, tamper detection | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Nivel MSL | 3 | — |
| Estado RoHS | Compliant | Compliant |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Device Family | — | Cyclone III LS |
| Logic Elements (LE) | — | 100,448 |
| Total Memory Bits | — | 4,451,328 |
| Embedded Memory Blocks | — | M9K + M144K |
| Logic Array Blocks (LAB) | — | 6,278 |
| Core Supply Voltage (VCCINT) | — | 1.2 V |
| Analog Supply (VCCA) | — | 2.5 V |
| Maximum Embedded Multipliers (18x18) | — | 244 |
| Package Dimensions | — | 29 mm x 29 mm, 1.0 mm ball pitch |
| Operating Temperature (Commercial) | — | 0C to +85C |
| Configuration Schemes | — | AS, PS, PP, JTAG |
| Lead-Free | — | Yes |