EP3CLS200F484C7 vs EP3CLS150F484C7 Vergleich
Detaillierter Direktvergleich von EP3CLS200F484C7 von Intel und EP3CLS150F484C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS200F484C7 | EP3CLS150F484C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.720,00 | $720,00 |
| Family | Cyclone III LS | Cyclone III LS |
| Logic Elements (LE) | 198,464 | 149,760 |
| Logic Array Blocks (LABs) | 12,408 | — |
| Embedded Memory (RAM bits) | 8,211,456 | — |
| Maximum User I/Os | 226 | — |
| DSP Blocks | 396 (18x18 multipliers) | — |
| PLLs | 4 | 4 |
| Core Supply Voltage (VCCINT) | 1.2 V | — |
| I/O Supply Voltage (VCCIO) | 1.2 V to 3.3 V | — |
| Gehäuse | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch | 484-FBGA (FineLine BGA), 23 x 23 mm, 1.0 mm pitch |
| Process Technology | CMOS, low-power | 60 nm TSMC low-power CMOS |
| Betriebstemperatur | 0C to +85C (commercial, C7 speed grade) | — |
| Configuration Method | JTAG, Passive Serial, Active Serial | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Total Memory Bits | — | 6,138,560 |
| Embedded Multipliers (18x18) | — | 396 |
| User I/O Count | — | 210 |
| Configuration Logic Blocks (CLBs) | — | 150,848 |
| Maximum User I/O Pins | — | 210 |
| Supply Voltage Core (VCCINT) | — | 1.2 V |
| Supply Voltage Auxiliary (VCCAUX) | — | 2.5 V |
| Operating Temperature (Commercial) | — | 0C to +85C |
| AES Bitstream Encryption | — | AES-256 with 64-bit volatile key |