EP3CLS200F484C7 vs EP3CLS150F484C7 Comparación
Comparación detallada lado a lado de EP3CLS200F484C7 por Intel y EP3CLS150F484C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS200F484C7 | EP3CLS150F484C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.720,00 | $720,00 |
| Family | Cyclone III LS | Cyclone III LS |
| Logic Elements (LE) | 198,464 | 149,760 |
| Logic Array Blocks (LABs) | 12,408 | — |
| Embedded Memory (RAM bits) | 8,211,456 | — |
| Maximum User I/Os | 226 | — |
| DSP Blocks | 396 (18x18 multipliers) | — |
| PLLs | 4 | 4 |
| Core Supply Voltage (VCCINT) | 1.2 V | — |
| I/O Supply Voltage (VCCIO) | 1.2 V to 3.3 V | — |
| Encapsulado | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch | 484-FBGA (FineLine BGA), 23 x 23 mm, 1.0 mm pitch |
| Process Technology | CMOS, low-power | 60 nm TSMC low-power CMOS |
| Temperatura de funcionamiento | 0C to +85C (commercial, C7 speed grade) | — |
| Configuration Method | JTAG, Passive Serial, Active Serial | — |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Total Memory Bits | — | 6,138,560 |
| Embedded Multipliers (18x18) | — | 396 |
| User I/O Count | — | 210 |
| Configuration Logic Blocks (CLBs) | — | 150,848 |
| Maximum User I/O Pins | — | 210 |
| Supply Voltage Core (VCCINT) | — | 1.2 V |
| Supply Voltage Auxiliary (VCCAUX) | — | 2.5 V |
| Operating Temperature (Commercial) | — | 0C to +85C |
| AES Bitstream Encryption | — | AES-256 with 64-bit volatile key |