EP3CLS200F484C7 vs EP3CLS200F484C8 Vergleich
Detaillierter Direktvergleich von EP3CLS200F484C7 von Intel und EP3CLS200F484C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS200F484C7 | EP3CLS200F484C8 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.720,00 | $118,00 |
| Family | Cyclone III LS | Cyclone III LS (low-power Cyclone III) |
| Logic Elements (LE) | 198,464 | 198,464 |
| Logic Array Blocks (LABs) | 12,408 | — |
| Embedded Memory (RAM bits) | 8,211,456 | — |
| Maximum User I/Os | 226 | — |
| DSP Blocks | 396 (18x18 multipliers) | — |
| PLLs | 4 | 4 |
| Core Supply Voltage (VCCINT) | 1.2 V | — |
| I/O Supply Voltage (VCCIO) | 1.2 V to 3.3 V | — |
| Gehäuse | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch | 484-pin FBGA (FineLine BGA) |
| Process Technology | CMOS, low-power | 65 nm low-power CMOS |
| Betriebstemperatur | 0C to +85C (commercial, C7 speed grade) | 0C to +85C (commercial, 'C' suffix) |
| Configuration Method | JTAG, Passive Serial, Active Serial | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Series | — | Cyclone III LS |
| Logic Array Blocks (LAB) | — | 20,5056 (approx) |
| Embedded Memory | — | 8,211,456 bits (approx 8 Mbit) |
| Embedded 18x18 Multipliers | — | 210 |
| Maximum User I/O | — | 304 |
| I/O Banks | — | 8 |
| Core Voltage | — | 1.2 V |
| Package Dimensions | — | 23 mm x 23 mm, 1.0 mm ball pitch |
| Configuration Modes | — | AS, PS, FPP, JTAG |
| Security | — | Design encryption / bitstream AES |