EP3CLS200F484C7 vs EP3CLS200F484C8 Comparison
Detailed side-by-side comparison of EP3CLS200F484C7 by Intel and EP3CLS200F484C8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3CLS200F484C7 | EP3CLS200F484C8 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,720.00 | $118.00 |
| Family | Cyclone III LS | Cyclone III LS (low-power Cyclone III) |
| Logic Elements (LE) | 198,464 | 198,464 |
| Logic Array Blocks (LABs) | 12,408 | β |
| Embedded Memory (RAM bits) | 8,211,456 | β |
| Maximum User I/Os | 226 | β |
| DSP Blocks | 396 (18x18 multipliers) | β |
| PLLs | 4 | 4 |
| Core Supply Voltage (VCCINT) | 1.2 V | β |
| I/O Supply Voltage (VCCIO) | 1.2 V to 3.3 V | β |
| Package | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch | 484-pin FBGA (FineLine BGA) |
| Process Technology | CMOS, low-power | 65 nm low-power CMOS |
| Operating Temperature | 0C to +85C (commercial, C7 speed grade) | 0C to +85C (commercial, 'C' suffix) |
| Configuration Method | JTAG, Passive Serial, Active Serial | β |
| RoHS Status | Compliant | Compliant |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Series | β | Cyclone III LS |
| Logic Array Blocks (LAB) | β | 20,5056 (approx) |
| Embedded Memory | β | 8,211,456 bits (approx 8 Mbit) |
| Embedded 18x18 Multipliers | β | 210 |
| Maximum User I/O | β | 304 |
| I/O Banks | β | 8 |
| Core Voltage | β | 1.2 V |
| Package Dimensions | β | 23 mm x 23 mm, 1.0 mm ball pitch |
| Configuration Modes | β | AS, PS, FPP, JTAG |
| Security | β | Design encryption / bitstream AES |