EP3CLS200F484C7N vs EP3CLS200F484C7 Vergleich
Detaillierter Direktvergleich von EP3CLS200F484C7N von Intel und EP3CLS200F484C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS200F484C7N | EP3CLS200F484C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.650,00 | $1.720,00 |
| Series | Cyclone III LS | — |
| Logic Elements (LE) | 198,464 | 198,464 |
| Logic Array Blocks (LAB) | 12,404 | — |
| Embedded Memory | 8,211,456 bits | — |
| Embedded 18x18 Multipliers | 210 | — |
| User I/O | 226 | — |
| Gehäuse | 484-ball FBGA (FineLine BGA, 23x23 mm) | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch |
| Core Voltage | 1.2 V | — |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (commercial, C7 speed grade) |
| Process Technology | 65 nm low-power CMOS | CMOS, low-power |
| Configuration Modes | AS, PS, JTAG (IEEE 1149.1) | — |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Number of I/O Banks | 8 | — |
| Hot Socketing | Supported | — |
| PLLs | 4 | 4 |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Family | — | Cyclone III LS |
| Logic Array Blocks (LABs) | — | 12,408 |
| Embedded Memory (RAM bits) | — | 8,211,456 |
| Maximum User I/Os | — | 226 |
| DSP Blocks | — | 396 (18x18 multipliers) |
| Core Supply Voltage (VCCINT) | — | 1.2 V |
| I/O Supply Voltage (VCCIO) | — | 1.2 V to 3.3 V |
| Configuration Method | — | JTAG, Passive Serial, Active Serial |