EP3CLS200F484C7N vs EP3CLS200F484C8N Vergleich
Detaillierter Direktvergleich von EP3CLS200F484C7N von Intel und EP3CLS200F484C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS200F484C7N | EP3CLS200F484C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.650,00 | $1.245,00 |
| Series | Cyclone III LS | Cyclone III LS |
| Logic Elements (LE) | 198,464 | — |
| Logic Array Blocks (LAB) | 12,404 | — |
| Embedded Memory | 8,211,456 bits | 8,211,456 bits (8.21 Mbit) |
| Embedded 18x18 Multipliers | 210 | — |
| User I/O | 226 | — |
| Gehäuse | 484-ball FBGA (FineLine BGA, 23x23 mm) | 484-ball FBGA (FineLine BGA), 23 x 23 mm |
| Core Voltage | 1.2 V | 1.2 V |
| Betriebstemperatur | 0C to +85C (commercial) | — |
| Process Technology | 65 nm low-power CMOS | 65 nm CMOS, low-leakage |
| Configuration Modes | AS, PS, JTAG (IEEE 1149.1) | — |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Number of I/O Banks | 8 | — |
| Hot Socketing | Supported | — |
| PLLs | 4 | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Family | — | Cyclone® III LS |
| Logic Elements | — | 198,464 |
| Logic Array Blocks (LABs) | — | [DATA_NEEDED: exact LAB count] |
| Embedded Multipliers (18x18) | — | 396 |
| User I/O Pins | — | 210 |
| Number of PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Maximum Operating Frequency | — | 402 MHz (fabric) |
| Speed Grade | — | 8 (slowest) |
| Temperature Grade | — | Commercial (0C to +85C TJ) |
| Bitstream Encryption | — | AES-128 (256-bit key via separate license) |
| Configuration Mode | — | Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG |